Recycle Infineon ToF 3D Image Sensors:ToF 3D Image Sensor For Consumer/Automotive /Industrial,VCSEL Driver
Shenzhen Mingjiada Electronics Co., Ltd. is a leading company in the electronic component recycling sector, specialising in the recycling of all types of electronic components. We provide global clients with efficient and compliant inventory disposal solutions, helping them to quickly recover funds and optimise warehouse management.
[Recycling Process]
Submit Details: Simply provide the details of the Lattice evaluation boards to be recycled via email or telephone, including the model number, quantity, condition and photographs.
Accurate Quotation: Our specialist team will typically complete the assessment and provide a competitive quotation within 12 to 24 hours.
Secure Handling: We offer a free nationwide door-to-door collection service covering multiple cities, or arrange insured global logistics services via carriers such as DHL, UPS and SF Express to ensure safe transport.
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The Infineon XENSIV™ REAL3™ indirect time-of-flight (iToF) product portfolio comprises ToF 3D image sensors and VCSEL vertical-cavity surface-emitting laser) drivers, delivering an integrated design for depth imaging, light source drive and safety protection. It serves a wide range of industries, including consumer electronics, in-vehicle cockpits and industrial automation. Thanks to patented pixel backlight suppression technology and high modulation rate drive capability, it delivers stable and reliable 3D depth data under complex conditions—including strong light, darkness, and extreme temperatures—thereby equipping end devices with real-time 3D environmental perception capabilities.
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Core Features of the REAL3™ ToF 3D Image Sensor
The REAL3™ series of iToF sensors are based on mature CMOS processes and incorporate pmd pixel technology. Each pixel features a patented SBI backlight suppression circuit, which effectively suppresses interference from strong ambient light such as sunlight, enabling the precise output of depth maps and infrared greyscale images both indoors and outdoors; The devices undergo full calibration prior to shipment and require no recalibration throughout their entire lifecycle, thereby reducing module production and subsequent maintenance costs. Furthermore, they support configurable HDR (High Dynamic Range), multiple modulation frequencies and multi-camera synchronisation modes, significantly reducing the computational load on the host processor.
I. Representative Consumer & Industrial-Grade Devices: IRS2875C / IRS2975C
- Resolution: HQVGA 240×180, 43K pixels, 940 nm infrared operating wavelength, die-on-chip packaging, suitable for miniaturised module design
- Pixel technology: 5th/6th generation PMD pixels, highly photosensitive embedded optical reflectors, on-chip SBI (Strong Light Suppression) for balanced ranging accuracy and low power consumption
- Temperature range: –40°C to +85°C; compliant with RoHS halogen-free specifications
- Compatible driver: IRS9102C consumer-grade VCSEL driver, enabling full system matching between light source and imaging
- Applications: Consumer electronics (smart door locks, AR/VR devices, mobile terminals, robotic vacuum cleaners); industrial applications (obstacle avoidance and navigation for service robots, 3D inspection in warehousing and logistics, environmental perception for drones, human-machine interaction with equipment)
II. Representative Automotive-Grade Device: IRS2877A
- Resolution: VGA-grade; AEC-Q100 automotive-grade certified; supports ISO 26262 ASIL-B functional safety level; LFBGA plastic-encapsulated package; operating temperature range: –40°C to +105°C
- Designed for in-vehicle cabin perception (ICMS), supporting functions such as occupant presence detection, passenger posture recognition, child left-behind detection and intelligent airbag deployment; compatible with complex in-vehicle lighting conditions and extreme temperature fluctuations
- Compatible driver: IRS9103A automotive-grade VCSEL driver, fully compliant with in-vehicle functional safety and laser safety requirements
III. Analysis of Complementary VCSEL Driver Products
Infineon’s VCSEL drivers work in close synergy with REAL3 ToF sensors. They integrate LVDS differential signal reception, gate drive and power switching units onto a single chip, eliminating the need for numerous discrete peripheral components, thereby simplifying the BOM (Bill of Materials) and reducing the size of the camera module; Featuring nanosecond-level high-speed switching and multiple hardware fault protection mechanisms, they ensure stable modulation of the VCSEL light source and laser safety for the human eye. The product range is divided into two main lines: consumer/industrial grade and automotive grade.
IV. Consumer/Industrial Grade VCSEL Driver IRS9102C
- Package: PG‑TSNP‑10 micro-package, dimensions 1.1 × 1.5 mm, maximising PCB space savings
- Key electrical parameters: Peak laser current up to 12 A, laser voltage 6 V, maximum modulation frequency 250 MHz, rise/fall time < 1 ns; supports driving dual-junction VCSEL arrays; powered by a 3.3 V system rail, with no need for an additional boost power supply
- Built-in protection: Multiple fail-safe mechanisms including thermal shutdown, under-voltage lockout and pulse width limiter ensure stable VCSEL light source operation and laser safety
- Applications: Consumer electronics ToF cameras, XR devices, domestic robots, industrial vision ranging, and laser scanning LDS systems; forms a complete 3D perception solution when combined with the IRS2875C and IRS2975C
V. Automotive-Grade VCSEL Driver IRS9103A
- Automotive-grade certification: AEC‑Q100 Grade 2 certified; 1.35 × 1.35 mm wafer-level PG‑WFWLB‑9 package; stable operation within the automotive wide temperature range of –40 °C to +105 °C
- Key electrical parameters: peak current 10 A, laser voltage up to 14 V, modulation frequency up to 130 MHz; capable of driving two sets of triple-junction VCSEL arrays; powered directly by a 3.3 V on-board supply, simplifying the in-vehicle power architecture
- Safety mechanisms: Integrated hardware protection against overtemperature, undervoltage and pulse clipping, meeting functional safety requirements for cockpit applications; compatible with the IRS2877A automotive ToF sensor to build an automotive-grade 3D imaging system
- Designed for automotive applications: In-vehicle occupant monitoring (ICMS), and can also be extended for low-speed autonomous driving perimeter perception and short-range 3D detection scenarios outside the vehicle cabin
VI. Implementation in Three Major Sectors
Consumer Electronics Sector
A complete ‘sensor + driver’ solution for 3D facial recognition in smart door locks, assisted depth focusing in mobile phones, spatial positioning and tracking in AR/VR, and 3D mapping and obstacle avoidance in domestic service robots; compact bare dies and micro-driver chips enable slimline designs in end devices, whilst low-power characteristics make them suitable for battery-powered portable devices, ensuring reliable recognition and obstacle avoidance even in bright light conditions.
Automotive Electronics Sector
Automotive-grade REAL3 ToF sensors paired with the IRS9103A driver serve as the core of in-vehicle perception, enabling occupant detection, liveness detection and child left-behind monitoring, whilst supporting the tiered deployment of intelligent airbags; the entire system has undergone automotive-grade reliability and functional safety validation, withstanding harsh conditions such as direct sunlight inside the vehicle, cold-start operations and exposure to high temperatures, making it a vital perception hardware component for smart cockpits.
Industrial Sector
It can be deployed in commercial service robots, warehouse AGVs, drones and industrial human-machine interface devices, outputting real-time 3D point clouds to enable obstacle detection, spatial modelling and object dimension measurement; SBI backlight suppression technology allows the equipment to operate across indoor and outdoor scenarios, whilst high-reliability hardware protection ensures suitability for complex industrial environments such as factories and logistics warehouses, reducing computational load on algorithms and accelerating the implementation of industrial 3D vision projects.
VII. Comprehensive Advantages of the Solution
1. High degree of hardware-software integration: The ToF sensor and VCSEL driver are optimised as a complete set by the original manufacturer; the high-speed LVDS interface ensures signal integrity and EMC compliance, reducing customer debugging time and enabling rapid time-to-market.
2. Robust performance across all operating conditions: Patented pixel backlight suppression overcomes interference from sunlight; multi-level hardware protection mechanisms balance light source lifespan with human eye safety; Components graded for consumer, industrial and automotive applications meet the reliability standards of different industries.
3. Miniaturisation and reduced BOM: A highly integrated single-chip solution reduces the number of peripheral components, minimises module size and lowers overall bill of materials (BOM) costs, making it suitable for slim consumer devices, compact in-vehicle cameras and small industrial sensing modules.
4. Comprehensive ecosystem support: Accompanied by deep processing algorithms and mass-production reference designs, with module development support provided in collaboration with ecosystem partners, covering the entire process from prototype development to high-volume production, and widely adopted in mass-produced end products globally.
The combination of Infineon’s REAL3™ ToF 3D image sensor and VCSEL driver bridges the gap between imaging sensing and light source drive, providing a mature, mass-producible iToF 3D vision hardware foundation for consumer electronics, automotive cockpits and industrial automation.
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